Chipbond and International Semiconductor Technology (IST) Delay Capacity Expansions

Chipbond and IST are driver IC packaging companies. Driver ICs go into LCD panels and control the thin-film-transistors (TFT) that control the currents that control the liquid crystals (LCs) that control light that control what you see in front of your screen. Boy, that was a mouth-full. These two companies are expecting slow Q2 sales and capacity expansions slated for 1H'06 have now been delayed to 2H'06.

Chipbond will maintain tape carrier package (TCP) and chip on film (COF) packaging capacity at 30 million per month by 2006E. Its gold-bumping capacity will remain the same at 180K per month. IST's chip on glass (COG) capacity is expected to reach 31 million per month by 2006E and its TCP+COF packaging capacity will hit 38 million per month.

Source: Digitimes

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