AGC Back-Grinding Glass Substrate

AGC (PDF):

While stacking chips vertically enhances the functionality of semiconductors used in mobile terminals, the thickness of individual chips must be reduced to enable such a vertical structure. These thin semiconductor chips are produced by supporting silicon wafers on a glass substrate called a back-grinding substrate (BG substrate) and grinding them to reduce their thickness to about 50 μm. […]

AGC Electronics plans to capture 50% share of a forecasted ¥10 billion market by 2014.